Archive for category: News

SupraSol WLT-M03

Selected in the top 10 R&D awards by the Ministry of Trade, Industry and Energy in 2023: “HBM semiconductor process technology and materials”

By the Ministry of Trade, Industry and Energy’s R&D excellence, Hojin Platech’s technological advancements in “High Bandwidth Memory (HBM) s...

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SupraSol WLT-M01

Micro Bump Pure Tin Plating Process for HBM Application (Micro-Bump Plating, SupraSol WLT-M)

  SupraSol WLT-M, process for the Micro-Bump Pure Tin plating of High Bandwidth Memory (HBM) semiconductor, has been qualified by SK Hynix with suppor...

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The development of Nickel-Iron alloy plating, Ni-Fe Permalloy Hoplalloy NF-20

We are pleased to announce the launch of new Nickel-Iron alloy plating solution, Hoplalloy NF-20. Hoplalloy NF-20 offers a versatile range of alloy co...

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SupraSol WLS

The development of wafer bump plating process, Lead-Free Solder Bump plating (SupraSol WLT/WLS)

    We are excited to announce the launch of new wafer bump plating process. SupraSol WLT/WLS is designed for semiconductor wafer bump plating, utili...

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Attending KCPA show 2018

Hello! HojinPlatech will attending KCPA show 2018. We are looking forward to seeing and talking to you, guys. See you there! Thanks! Exhibition Info D...

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Hello! Hola! ようこそ! 您好! 안녕하세요!

Hello! Hola! ようこそ! 您好! 안녕하세요! Welcome to HojinPlatech is a manufacturer of Surface Finishing Chemicals located in Ansan, South Korea....

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engineering-001 is Developing

Hello! is under developing. We look forward to providing better online-services. See You, then!

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