By the Ministry of Trade, Industry and Energy’s R&D excellence, Hojin Platech’s technological advancements in “High Bandwidth Memory (HBM) s...
SupraSol WLT-M, process for the Micro-Bump Pure Tin plating of High Bandwidth Memory (HBM) semiconductor, has been qualified by SK Hynix with suppor...
We are pleased to announce the launch of new Nickel-Iron alloy plating solution, Hoplalloy NF-20. Hoplalloy NF-20 offers a versatile range of alloy co...
We are excited to announce the launch of new wafer bump plating process. SupraSol WLT/WLS is designed for semiconductor wafer bump plating, utili...
Hello! HojinPlatech will attending KCPA show 2018. We are looking forward to seeing and talking to you, guys. See you there! Thanks! Exhibition Info D...
Hello! Hola! ようこそ! 您好! 안녕하세요! Welcome to Hojinplatech.com HojinPlatech is a manufacturer of Surface Finishing Chemicals located in Ansan, South Korea....
Hello! Hojinplatech.com is under developing. We look forward to providing better online-services. See You, then!
