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SLOTOCOUP SF-30
SLOTOCOUP SF-30
2020년 8월 30일
Copper & Its Alloys
Plating
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인쇄회로기판 Micro Via Hole Filling에 특화된 동 도금 첨가제
Characteristic:
Via Fill
Anode:
insoluble anodes
Optimal Temp(°C):
50~60(55)
Manufacturer:
Schlötter
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