HojinPlatech Co., Ltd.
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  • ABOUT
  • PRODUCTS & SERVICES
    • CHEMICAL PRODUCTS
      • SEMICONDUCTOR
      • GMF
      • CONNECTOR
      • PCB
      • SOLAR CELL
      • UMICORE
    • ENGINEERING SERVICES
  • NEWS
  • CONTACT
  • 한국어
  • English
HojinPlatech Co., Ltd.
  • HOME
  • ABOUT
  • PRODUCTS & SERVICES
    • CHEMICAL PRODUCTS
      • SEMICONDUCTOR
      • GMF
      • CONNECTOR
      • PCB
      • SOLAR CELL
      • UMICORE
    • ENGINEERING SERVICES
  • NEWS
  • CONTACT
  • 한국어
  • English

CHEMICAL PRODUCTS

We are supplying chemical products for plating & surface finishing

HojinPlatech Co., Ltd. > CHEMICAL PRODUCTS

for SEMICONDUCTOR

  • Cleaner
  • Deflash
  • Descale & Etching
  • Tin & its Alloy Plating
  • Stripper
  • Others

for GMF

  • Zinc & its Alloy
  • Chromate
  • Coating
  • Sealing

for CONNECTOR

  • Cleaner
  • Descale & Etching
  • Tin & its Alloy Plating
  • Stripper
  • Others

for PCB

  • Cleaner
  • Soft Etching
  • Brown Oxide
  • Acid Copper Plating
  • Stripper
  • Others

for SOLAR CELL

  • Cleaner
  • Texturing
  • Etching
  • Plating
  • Stripper
  • Others

Company Info.

HojinPlatech Co., Ltd.
Headquarters:
Lot 1 Block 15, Banwol Industrial Complex
91 Moknaero119, Danwongu, Ansan, Gyeonggi-do,
Republic of Korea
TEL. +82-31-493-8141~4 / +82-70-4707-5560
FAX. +82-31-493-7887

Palgok Factory:
22 Palgoksandan 4-gil, Sangnok-gu, Ansan-si, Gyeonggi-do, Republic of Korea
TEL. +82-31-493-8143 FAX.+82-31-502-2088

Quick Links

  • HOME
  • ABOUT
  • CHEMICAL PRODUCTS
  • SEMICONDUCTOR
  • GMF
  • CONNECTOR
  • PCB
  • SOLAR CELL
  • Umicore (External Link)
  • Schlötter (External Link)
  • riag (External Link)

Recent Company News

  • Selected in the top 10 R&D awards by the Ministry of Trade, Industry and Energy in 2023: “HBM semiconductor process technology and materials”
    in News
  • Micro Bump Pure Tin Plating Process for HBM Application (Micro-Bump Plating, SupraSol WLT-M)
    in News
  • The development of Nickel-Iron alloy plating, Ni-Fe Permalloy Hoplalloy NF-20
    in News
  • The development of wafer bump plating process, Lead-Free Solder Bump plating (SupraSol WLT/WLS)
    in News
  • Attending KCPA show 2018
    in News
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  • HOME
  • ABOUT
  • PRODUCTS & SERVICES
    • CHEMICAL PRODUCTS
      • SEMICONDUCTOR
      • GMF
      • CONNECTOR
      • PCB
      • SOLAR CELL
      • UMICORE
    • ENGINEERING SERVICES
  • NEWS
  • CONTACT
  • 한국어
  • English