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Cleaner

▶ Cleaner

Usage PN* Characteristics
Steel and non-steel metal electrolytic degreaser SupraClean EC-10
  • Recommended for phosphor copper for its low sodium hydroxide content
  • Recommended for positive and negative pole electrolytic degreasing process
  • Can be applied to various metals such as steel, non-steel, zinc die-casting, and phosphor copper
SlotoClean EL-300
  • Almost no toxic gas
    Solution type; no dust during make-up or replenishment
  • Excellent adhesion through positive pole degreasing
  • Recommended for rack, barrel, and reel-to-reel
SlotoClean EL-KG
  •  Strong alkaline solution using electrolysis of metal material of steel and non-steel
  • Does not contain cyanide
  • Suitable for application on Rack , Barrel, and Reel to Reel equipment

PN* = Product Name

Descale & Etching

▶ Descale & Etching

Usage PN* Characteristics
Copper, copper alloy, and Alloy42 Activator SupraEtch PS-35
  • Uniform etching
  • Excellent removal of copper oxidized layer
  • Easy control of etching rate and excellent adhesion with plating layer
  • Excellent wastewater treatment and operation safety because it is fluoride-free
  • Excellent operation safety on Alloy-42 material
Slotetech 584
  • Effectively removes oxidized film on surface
  • Excellent adhesion with tin, tin-lead plating layer
  • Excellent operation safety on Alloy 42
  • Easy control of the Etching Rate
    Uniform etching effect
 Slotetech 20
  • Effectively removes oxidized film on surface
  • Easy control of the Etching Rate
  • Uniform etching effect
Copper alloy Olin 7025 Activator SupraEtch-7025
  • Excellent adhesion even at very low etching rate
  • No black smut even in Olin C-151, 7025 materials
  • Easy control of etching rate based on the hydrogen peroxide concentration
  • Excellent wastewater treatment and operation safety because it is fluoride-free
  • Liquid form making handling of solution easy; excellent removal of copper oxidized layer
Alloy 42 Activator SupraEtch DS-42
  • No toxic gas, with sulphuric acid as the main ingredient
  • No discoloration of material even after the material settles in the solution for more than 5 minutes
  • Excellent flushability
  • Excellent adhesion even at very low etching rate
  • Saves on production cost owing to the long life of solution
SupraEtch DS-70
  • Excellent oxidized film removal effect, with nitric acid as the main ingredient
  • No discoloration of material even after the material settles in the solution for more than 5 minutes
  • No chemical particle owing to its excellent flushability

PN* = Product Name

Tin & its Alloy Plating

▶ Tin & it Alloy Plating

Usage PN* Characteristics
Gloss tin plating (Rack, Barrel) Bright Tin Culmo
Supra Tin LS-30
  • Excellent gloss effect as a gloss plating solution with sulphuric acid
  • Offers excellent heat resistance and uniform shine plating effect
  • Excellent prevention of corrosion and discoloration
  • Suitable for rack and barrel process
HopraTin LB-10
  • Low speed tin plating solution with MSA
  • Excellent for soldering; low organic matter in plating layer
  • Uniform gloss plating effect
Non-gloss tin plating (Rack, Barrel) SlotoTin 50
  • No-gloss tin plating process with MSA
  • Suitable for rack and barrel process
 SupraTin S-10
  • No-gloss tin plating process with sulphuric acid
  • Bright and fine plating layer
  • Low carbon content in plate layer
 SupraTin S-30M
  • No-gloss tin plating process with MSA
  • Bright, fine plating layer
  • Low carbon content in plate layer
Tin, tin-lead plating HopraTin MA-30
  • Specially developed for plating Varistor, MLCC, Chip Resistors
  • Excellent for soldering; no twin or sticking flaws
  • Solution safe and easy to manage
  • No Over-Growth defects
SupraSol HS
  • Suitable for high-speed plating as tin-lead alloy plating solution with MSA
  • Fine, detailed pure white plating layer
 Glossy tin high-speed plating HopraTin HB-10
  • Excellent gloss and uniform plating effect
  • Low organic matter content in plate layer
  • Excellent for soldering, easy high-speed plating
 Tin-silver alloy plating  Slotoloy SNA
  • Lead-free Sn/Ag (10% Ag) alloy plating process
  • Excellent for soldering even after a long period of aging
  • Rack, Barrel, and Reel-To- Reel applied
 Tin-copper alloy plating  Slotoloy SNC
  • Lead-free Sn/Cu (1 to 10% Cu) alloy plating process
  • Very low organic matter content; excellent for soldering
  • Rack, Barrel, and Reel-To- Reel applied
 Nickel plating  HoplaNik Series
  • Solution safe and easy to manage
  • Excellent gloss, great leveling
  • Applied to Barrel and Reel-To- Reel
 Copper plating  Bright Copper SG1
  • High gloss, smooth plate layer
  • Solution easy to manage; suitable for thick plating
  • Low internal stress; can be used in high current density
  • Dummy plating not required even when restarted after being idle for a certain period of time

PN* = Product Name

Stripper

▶ Stripper

Usage PN* Characteristics
Tin, tin-lead, lead stripper SupraStrip M-100
  • Rework stripper that strips tin, tin-lead, and lead from copper, copper alloy, nickel, and nickel alloy
Tin, tin-lead stripper Stripper BSM
  • Tin and tin-lead stripper with organic acid
  • No heat generation effect for easy management of solution
Tin and tin alloy stripper SupraStrip NBS-10
  • Tin and tin-lead alloy belt stripper with nitric acid
  • Suitable for both precipitation and spray
Nickel stripper SupraStrip Ni Series
  • Strips nickel layer that has been plated through electrolysis and non-electrolysis from copper
  • Fast stripping effect; easy to use
  • Almost no toxic gas
Silver plating stripper SupraStrip Ag-60
  • Causes no corrosion on Alloy42 and copper alloy as a silver plating stripper
Gold plating stripper SupraStrip Au-80
  • Minimized copper and nickel layer corrosion as a gold plating stripper
  • Suitable for the gold plating stripping of electronic goods
  • Easy to use, since there is no toxic matter

PN* = Product Name

Others

▶ Others

Usage PN* Characteristics
Stannic (Sn4+) precipitator FMN
  • Precipitator to remove Sn 4+ in tin and tin-lead plating
  • Remains in solution but does not affect plating
  • Easy to manage solution after precipitation; does not affect Sn 2+
Tin plating neutralizer Neutralizer NT-10
  • Tin plate neutralizer
  • Suitable for various treatments (Barrel, Rack, Reel to Reel)
  • Non-foaming
  • Can be used in wide temperature range; easy to use at room temperature

PN* = Product Name