Chemical Products

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SEMICONDUCTOR

Cleaner

 ▶ Cleaner

Usage PN* Characteristics
Steel and non-metal electrolytic degreaser SupraClean EC-10
  • Recommended for phosphor copper owing to its low sodium hydroxide content
  • Recommended for positive and negative pole electrolytic degreasing process
  • Can be applied to various metals such as steel, non-steel, zinc die-casting, and phosphor copper
SlotoClean EL-300
  • Almost no toxic gas
  • Solution type; no dust during make-up or replenishment
  • Excellent adhesion through positive pole degreasing
  • Recommended for rack, barrel, and reel-to-reel

PN* = Product Name

Deflash

 ▶ Deflash

Usage PN* Characteristics
Deflash SupraClean AD-10
SlotoClean DF-11M
  • Recommended for removing resin and mold flash from semiconductor lead frame
  • Can be applied to both high- and low-speed plating equipment
  • Can also be used for removing dry film
  • Almost no toxic gas
  • Excellent washing
  • Easy wastewater treatment owing to low COD content
  • Almost no carbonate compound created

PN* = Product Name

Descale & Etching

 ▶ Descale & Etching

Usage PN* Characteristics
Copper, Copper plating, and Alloy42 Activator SupraEtch PS-35
  • Uniform etching
  • Excellent removal of copper oxidized layer
  • Easy control of etching rate and excellent adhesion with plating layer
  • Excellent wastewater treatment and operation safety: fluoride-free
  • Excellent operation safety on Alloy-42 material
 Copper alloy Olin 7025 Activator SupraEtch-7025
  • Excellent adhesion even at very low etching rate
  • No black smut even in Olin C-151, 7025 materials
  • Easy control of etching rate based on the hydrogen peroxide concentration
  • Excellent wastewater treatment and operation safety: fluoride-free
  • Liquid form making the handling of solution easy: excellent removal of copper oxidized layer
Alloy 42 Activator SupraEtch DS-42
  • No toxic gas, with sulphuric acid as the main ingredient
  • No discoloration of material even after the material settles in the solution for more than 5 minutes
  • Excellent flushability
  • Excellent adhesion even at very low etching rate
  • Saves on production cost based on the long life of solution
SupraEtch DS-70
  • Excellent oxidized film removal effect, with nitric acid as the main ingredient
  • No discoloration of material even after the material settles in the solution for more than 5 minutes
  • No chemical particle owing to its excellent flushability

PN* = Product Name

Tin & its Alloy Plating

 ▶ Tin & its Alloy Plating

Usage PN* Characteristics
No-gloss tin plating Supra Tin HT-30
  • Reel-to-reel, no-gloss tin plating process with MSA
  • Bright, fine plating layer
  • Low carbon content, suitable for high-speed plating
  • Excellent for soldering; no discoloration on surface after soldering
SlotoTin MB 110
  • Reel-to-reel, no-gloss tin plating process with MSA
  • Fine, detailed pure white plating layer
  • Excellent for soldering; almost no whisker effect
Supra Tin HT-40
  • Reel-to-reel no-gloss tin plating process with MSA
  • Uniform size (3~5㎛) of plating layer possible as a lead-free product
  • Very low organic matter content (0.003%)
  • Excellent for soldering; minimized whisker effect
Tin bismuth alloy plating Slotoloy SNB Series
  • Lead-free Sn/Bi (10% Bismuth) alloy plating process (for Reel To Reel)
  • Excellent for soldering; suitable for semiconductor and electronic goods plating
  • Maximum control of bismuth metathesis
  • Minimized whisker effect
Tin-silver alloy plating Slotoloy SNA
  • Lead-free Sn/Ag (10% Ag) alloy plating process
  • Excellent for soldering even after a long period of aging
  • Rack, Barrel, and Reel-To- Reel applied
Tin-copper alloy plating Slotoloy SNC
  • Lead-free Sn/Cu (1~10% Cu) alloy plating process
  • Stable solution and very low organic matter content; excellent for soldering
  • Rack, Barrel, and Reel-To- Reel applied
Tin-lead alloy plating SupraSol HS
  • Suitable for high-speed plating as a tin-lead alloy plating solution with MSA
  • Fine, detailed pure white plating layer

PN* = Product Name

Stripper

 ▶ Stripper

Usage PN* Characteristics
Tin, tin-lead stripper Stripper BSM
  • Tin and tin-lead stripper with organic acid
  • No heat generation effect; solution can be easily managed
Tin-bismuth stripper SupraStrip Bis-10
  • Sn-Bi plating stripper plated onto Alloy 42
  • No sumt for Alloy42 after stripping
  • No settling of particles after stripping
SupraStrip Bis-20
  • Sn/Bi plating stripper plated onto copper and copper alloy
  • Uniform copper surface after stripping; minimal corrosion
  • Low heat generation; does not require separate analysis and management
Belt stripper SupraStrip Bis-30
  • Tin, tin-bismuth plating belt stripper with nitric acid
  • High stripping speed, low heat generation and toxic gas
  • Low corrosion on equipment, excellent working environment
SupraStrip Bis (Belt)
  • Tin, tin-bismuth plating belt stripper with nitric acid
    High stripping speed, low heat generation and toxic gas
    Low corrosion on equipment, excellent working environment
SupraStrip NBS-10
  • Tin and tin-lead alloy belt stripper with nitric acid
  • Suitable for both precipitation and spray

PN* = Product Name

Others

 ▶ Others

Usage PN* Characteristics
Anti-tarnish AntiTarnish ALS 30
  • Tin plate anti-tarnish
Tin plating neutralizer Neutralizer NT-10
  • Tin plate neutralizer
  • Suitable for various treatments (Barrel, Rack, Reel to Reel)
  • Non-foaming
  • Can be used in wide temperature range; easy to use at room temperature
Gold plating post-treatment HoplaSeal Au-820
  • Gold plate sealer to enhance corrosion resistance of plating layer
  • Excellent prevention of corrosion of surface after plating
Stannic (Sn4+) precipitator FMN
  • Precipitator to remove Sn 4+ in tin and tin-lead plating
  • Remains in solution but does not affect the plating
  • Solution easy to manage after precipitation; does not affect Sn 2+

PN* = Product Name